Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
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1～21 item / All 21 items
Ultra-compact rugged industrial PC equipped with Intel Elkhart Lake processor.
Ultra-compact chassis measuring 100mm (L) x 100mm (W) x 40mm (H) equipped with Intel Elkhart Lake x6413E. A rugged box PC with excellent wide temperature range and shock and vibration resistance.
Ultra-compact fanless industrial BOX PC featuring Intel Celeron J6412 (Elkhart Lake)【NP-6116】
The NP-6116-J6412 is an ultra-compact, fanless, low-power industrial computer measuring (L)138mm x (W)102mm x (H)48mm. It is equipped with an Intel Elkhart Lake Atom processor and is suitable for applications with space constraints in factories, such as data collection, AIoT, edge computing, and gateways. The NP-6116-J6412 features 3 GbE LAN ports, 3 USB ports, 1 RS232 port, 1 RS485 port, and 1 HDMI and 1 DP port each. Additionally, it includes one full-size miniPCIe slot, SMBus, and 8-bit GPIO available via pin headers.
A compact, low-power, and high-efficiency system.
Providing optimal performance for embedded applications in limited spaces. Robust and capable of withstanding dust, shock, and vibration, as well as a wide temperature range (-40°C to 70°C), 9-48 VDC wide range power input, and abundant I/O expansion, making it suitable for various industrial automation, kiosks & retail, and digital signage (high demand for graphics).
Fanless BOX PC equipped with 8th generation Intel Core processor [SKY2-2I810D]
8th Gen Intel Whiskey Lake-U processor adopted Compact fanless design (108 x 102 mm) Wide temperature range support -20℃ to 60℃ 4 GbE LAN communication support
Industrial BOX PC equipped with OSM L size module featuring Intel Apollo Lake/Elkhart Lake processors.
System modules equipped with Intel Apollo Lake/Elkhart Lake processors compliant with the Open Standard Module (OSM) specifications established by SGeT* Advanced microcomputing design suitable for all industrial markets. * SGeT; Standardization Group for Embedded Technologies
BOX PC equipped with Intel 11th Generation Processor and Hailo-8 AI Module【SKY 2-2I110AW + Hailo-8】
A compact fanless industrial PC that can be mounted on a DIN rail. It features the latest 11th generation Intel Tiger Lake-UP3 i7/i5/i3/Celeron processors and offers a wealth of interfaces and expansion capabilities. By combining the Hailo-8 edge AI module with the SKY 2 2I110AW system, it becomes possible to maximize the power of edge AI, significantly reducing your time to market. Furthermore, developers will be able to run complex deep learning and machine vision applications with ultra-low power consumption.
Best choice for digital signage: It can smoothly play 4K/60fps videos despite its ultra-compact size.
Adopts Android 10 as the OS. Equipped with an ARM quad-core CPU, it can smoothly play ultra-high-definition 4K/60fps videos despite its compact size. Thanks to low power consumption and low heat generation, it operates stably for long periods. It supports two types of Wi-Fi, 5GHz and 2.4GHz, as well as external storage of up to 2TB, making it convenient to use in various environments and ideal for digital signage.
Compact fanless BOX PC equipped with a power-saving 4-core Intel Celeron J1900.
■Intel Celeron J1900 ■2x GbE port, 1x USB 3.0, 5x USB 2.0 ■1x HDMI, 1x VGA Port ■Power Supply DC-In 12/19/24V ■Width 200× Height 55× Depth 150 mm
Ultra-compact industrial PC equipped with Intel Processor N97 (Alder Lake-N)
The new model of the compact high-performance real-time industrial automation PC, NP-6116-N97 The NP-6116-N97 can be utilized in a wide range of fields. - Aluminum chassis design with excellent heat dissipation - Superior expandability - Cost performance - Achieves stable performance while being compact
BOX PC equipped with Intel Atom processor and Hailo-8 AI module [SKY 2-2I640CW + Hailo-8]
A compact fanless industrial PC that can be mounted on a DIN rail. By adopting the Intel Elkhart Lake ATOM X6413E CPU / Celeron J6413 CPU processor, single-thread performance is improved by up to 1.7 times and multi-thread performance by up to 1.5 times compared to the previous generation processors, with graphics performance also enhanced by up to 2 times. It features a rich array of interfaces and expansion capabilities. The combination of the Hailo-8 edge AI module and the SKY 2 2I640CW system allows for maximizing the power of edge AI, significantly reducing the time to market for customers. Furthermore, developers will be able to run complex deep learning and machine vision applications with ultra-low power consumption.
High-performance BOX-PC equipped with Intel 7th generation Core i series processor.
■Compact, fanless ■Kaby Lake CPU ■4x GbE/8x USB 3.0 ■Supports RAID 0, 1, 5 ■M.2 M Key 2242/2280 ■Wide range power supply DC-In 12-24V ■Width 230 × Height 125 × Depth 200 mm
A compact fanless back box PC equipped with an Apollolake processor.
■Apollo Lake CPU ■4x GbE (PoE support) ■4 x USB 3.0, 2 x USB 2.0, 1 x HDMI ■Supports 2 x miniPCIe ■Wide temperature range support ■Wide range power supply DC-In 12-24V ■Width 215 × Height 55 × Depth 155 mm
Ultra-compact fanless PC equipped with high-performance Intel® Core i5-8365UE/Celeron® 4305UE processors optimized for AMR.
The Axiomtek eBOX560-52R-FL is a fanless embedded BOX PC equipped with an Intel® Core i5-8365UE/Celeron® 4305UE processor. It supports a wide operating temperature range of -10 to 50°C and offers shock resistance of up to 50G and vibration resistance of 3Grms. Despite its compact design, it delivers excellent performance, is power-efficient, and is equipped with a rich array of I/O interfaces, making it suitable for applications such as AMR, industrial equipment computers, device integration within cabinets, and collaborative robots.
Equipped with the 7th generation Kabelake-U processor, this is an ultra-low voltage model and a compact fanless back PC.
■CPU Kaby Lake-U Processor ■Memory UP to 16GB ■I/O Connectors 2x GbE ports; supports PoE 4 x USB 3.0, 4 x USB 2.0 1 x HDMI 6 x COM ports 16bit - GPIO Supports CANbus ■Storage Supports 2x Mini-PCIe 1x 2.5" HDD/SSD Bay 1x mSATA ■Supports extended temperature range
AI BOX equipped with NVIDIA Jetson Xavier NX module. Supports 8 ports of 100MbE with PoE.
This is a BOX PC equipped with the NVIDIA Jetson Xavier NX module. It features a compact SOM (System On Module) with a maximum computing power of 21 TOPS, equipped with the NVIDIA Jetson Xavier NX module. It has eight 100Mb Ethernet ports that support PoE, making it ideal for surveillance systems that combine network cameras and AI. It is equipped with interfaces such as USB and HDMI output, and can accommodate everything from proof of concept to mass production.
High-performance, space-saving, fanless design edge AI embedded computer.
The FOX 2I130DW is a high-performance embedded computer that adopts a fanless design in a compact chassis measuring just 132.5 (width) × 112.45 (depth) × 48 (height) mm. It is equipped with 13th and 12th generation Intel Core Raptor Lake-U / Alder Lake-U (i7 / i5 / i3) processors, delivering excellent computational performance for edge AI applications. It offers a rich array of I/O interfaces suitable for industrial applications: HDMI ×1 2.5GbE LAN ports ×4 (supporting high-speed networks) USB 3.2 ports ×3 COM ports ×2 (for industrial communication and control) Additionally, by utilizing the M.2 slot, it supports Wi-Fi 6 and 4G / 5G communication modules, enabling wide coverage and real-time data transmission. It is ideal for AIoT and edge gateway applications. The FOX 2I130DW, which condenses high performance into a robust and ultra-compact chassis, is an ideal solution for applications that require advanced computational processing in harsh environments.
Elkhart Lake processor equipped! Industrial BOX PC that can be used in harsh environments [RCO-1000-EHL series]
This device is the successor to the Intel J1900 CPU-equipped model, and the Intel Atom x6425E SoC it features provides advanced capabilities for robust edge performance, including an M.2 AI accelerator, 5G cellular, embedded CAN bus, multiple 4K displays, 2.5GbE LAN, and TPM 2.0 hardware security. The RCO-1000-EHL series offers three models—RCO-1000-EHL-10, RCO-1000-EHL-20, and RCO-1000-EHL-30—based on the number of expansion ports, allowing for easy customization to meet specific application needs. Optional modules include USB, COM, DIO, and Display. Like other RCO and VCO series, the RCO-1000-EHL series operates over a wide temperature range of -40°C to 70°C and can withstand 50G of shock and 5Grms of vibration. Additionally, it supports a wide voltage input range of DC 9V to 36V and is equipped with overcurrent and voltage protection features.
11th Gen Intel Tiger Lake-UP3, equipped with i7 / i5 / i3 / Celeron processors
The 【SKY2-2I110D】 is a cutting-edge AI solution that enhances graphics performance by combining the 11th generation Intel Core processor (Tiger Lake-UP3) with a new graphics architecture. It is an ideal BOX PC for deep learning and video analysis through edge AI computing. Despite its compact form factor, it is equipped with a rich array of interfaces and expandability, making it an optimal platform not only for AI but also for various industrial applications.
Equipped with 10th generation Intel Core processors, providing powerful computing power for harsh industrial environments【RCO-3000-CML】.
The RCO-3000-CML is built with AI edge performance in mind. This SFF fanless computer can leverage NVMe, 5G, and AI accelerators through M.2 expansion slots, despite its fanless and compact design. With an efficient heat dissipation design considering AI accelerators, the RCO-3000-CML can run robust AI applications even in harsh temperature, shock, and vibration environments. 5G/4G cellular (up to 3x SIM slots) Supports HAILO8 M.2 AI accelerator Scalable NVMe SSD storage
Amston Lake equipped with ultra-compact BOX PC [MIWA-731] series
The MIWA system is a compact and robust box-type PC ideal for applications in healthcare, edge AI, and factory automation. It supports a wide range of temperatures and offers abundant I/O options, making it the perfect solution for environments where reliability and performance are required.
Demo exhibition at EdgeTech+ 2023! Equipped with the Hailo-8 chip on board! Industrial PC for computing vision.
Pacifico Yokohama: Demonstration exhibition at "EdgeTech+ 2023" held in the Exhibition Hall / Annex Hall! ■ EdgeTech+ 2023 Event Overview Date: November 15 (Wednesday) - 17 (Friday), 2023 Venue: Pacifico Yokohama: Exhibition Hall / Annex Hall Participation Fee: Free (Pre-registration required via the website) https://go.f2ff.jp/et23sponsorpromoa Booth Number: C-K14 ■ Products Scheduled for Exhibition BOX PC equipped with Hailo-8 AI acceleration chip 【Compact Fanless Embedded Box PC】 Equipped with Intel Elkhart Lake Atom / Celeron processor 【Compact Rugged Box PC】 【Ultra-Compact Fanless Embedded Box PC】 Compact Vehicle-Mounted Android Rugged Tablet【5-10 inches】 Others
